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产品信息
FEATURES
For surface mounted applications
Low profile package ▪Glass Passivated Chip Junction
Ideal for automated placement
Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
Case: SOD-123FL
Terminals: Solderable per MIL-STD-750, Method 2026
Approx. Weight:15mg 0.0053oz
Maximum Ratings and Electrical characteristics
Ratings at 25 ambient temperature unless otherwise specified. Single phase half-wave 60 Hz, resistive or inductive load, for capacitive load current derate by 20 %